从设计角度看，EMIB-T不再局限于简单的2.5D互连，而是向3D封装技术Foveros靠拢，使得在更大芯片尺寸下实现高密度集成成为可能，为未来异构计算平台提供灵活封装架构。
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，更多细节参见搜狗输入法2026
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豫东平原的麦苗刚返青，风里还带着些许寒意。走进河南开封朱仙镇赵庄村，空气的味道却截然不同——那是一股醇厚清冽的松烟墨香，盖过了旷野的寒意，直往人心里钻。，这一点在爱思助手下载最新版本中也有详细论述